Event guide
2016.05.20
JEUPISTE/Osaka University WBG-i symposium on Power Electronics- Date
- Dec 15/16, 2015
- Place
- Hosted at the Delegation of the European Union to Japan 4-6-28 Minami-Azabu, Minato-ku, Tokyo 106-0047
Program:
DAY 1: “EU-Japan Cooperation in the Area of Next Generation Power Electronics Devices”
| Dec. 15, Tuesday Chairman: Prof. K. Suganuma |
|||
|---|---|---|---|
| Time | Title | Speaker | Affiliation |
| 10:00 | Welcome & Opening remarks | H.E. Viorel Isticioaia-
Budura |
Ambassador of the European Union to Japan |
| 10:05 | Prof. Y. Yagi | Executive Vice President of Osaka University | |
| Welcome speech | |||
| 10:10-10:25 | Welcome speech & EU-Japan STI cooperation | Dr. L. Karapiperis | Minister-Counsellor, Head of S&T Section, Delegation of the European Union to Japan |
| 10:25-10:40 | Power Electronics for Green Growth | Mr. S. Takegami | Director, Science and Technology Policy Planning Office, METI |
| R&D cooperation on power electronics and components technologies in the EU and Japan | |||
| 10:40-11:00 | Horizon 2020 and EU-Japan cooperation | Mr. S. Lambrecht | EU-Japan Centre for Industrial Cooperation |
| 11:00-11:30 | Power Electronics in Europe: Opportunities for EU-Japan cooperation | Mr. F.J. Ibañez | DG CNECT, European Commission |
| 11:30-12:00 | JST Super Cluster Program – Industry-Academia Collaborative R&D Program on SiC & GaN Power Electronics – | Dr. A. Suzuki | JST |
| Lunch break | |||
| Chairman: Prof. M. Ogura | |||
| Power electronics developments and expectations | |||
| 13:00-13:20 | Power Devices- A Driving Technology for Power Electronics Development The Role of ECPE | Prof. L. Lorenz | ECPE |
| 13:20-13:40 | Next Generation Power Electronics for Hybrid Vehicles | Mr. K. Toda | Toyota |
| 13:40-14:00 | Opportunities and Expectations for Future Power Electronics for MV Applications | Dr. F. Canales | ABB (Switzerland) |
| 14:00-14:20 | Progresses in technologies of power supply system and power devices to reduce power consumption of ICT equipment | Dr. Y. Akiyama | NTT laboratory |
| Coffee break | |||
| Chairman: Prof. M. Asada | |||
| 15:00-15:20 | Development of Humanoid Robot ASIMO | Mr. S. Shigemi | Honda R&D |
| 15:20-15:40 | Power Electronics – The systems perspective | Mr. A. Donat | Siemens (Germany) |
| 15:40-16:00 | R&D Activities at AIST/TIA-nano on future power electronics using WBG semiconductors | Dr. H. Okumura | AIST |
| 16:00-16:20 | Wide band gap activities at Infineon | Dr. P. Friedrichs | Infineon (Germany) |
| 16:20-17:20 | Panel discussion and Q&A
“What are the key facets for realizing next generation power electronic devices and EU-Japan cooperation in this area?” |
Moderators:
Prof. L. Lorenz Prof. T. Funaki
|
ECPE
Osaka University
|
| At the end of each session, there is the possibility for the audience to ask questions. | |||
DAY 2: “WBG Power Devices with Advanced Interconnects for Green Technology”
| Dec. 16, Wednesday Chairman: Prof. T. Muramatsu |
||||
|---|---|---|---|---|
| WBG semiconductors and modules | ||||
| 9:40-10:00 | Development of SiC power devices and modules in Rohm | Dr. H. Asahara | Rohm | |
| 10:00-10:20 | The Latest Power Module Packaging Technology for SiCs and New IGBTs | Dr. Y. Takahashi | Fuji Electric | |
| 10:20-10:40 | The WBG limiting factors for automotive applications | Mr. J.-M. Morelle | Valeo (France) | |
| Coffee break | ||||
| Chairman: Prof. J. Lutz | ||||
| 11:00-11:20 | DENSO R&D Activities on SiC Power Devices for Automotive Applications | Mr. K. Tsuruta | DENSO | |
| 11:20-11:40 | WBG of STMicroelectronics | Dr. L. Bartolomeo | STMicroelectronics (Italy) | |
| 11:40-12:00 | GaN-based Gate Injection Transistors for Power Switching Applications | Dr. M. Ishida | Panasonic | |
| 12:00-12:20 | High Performance Joining Techniques for WBG Modules | Dr. M. Guyenot | Bosch (Germany) | |
| Lunch Break | ||||
| Chairman: Prof. F. Iannuzzo | ||||
| Bonding materials & technology | ||||
| 13:20-13:40 | A Compact Smart and Reliable SiC-based Power Inverter for Automotive Applications | Dr. K. Brinkfeldt | Swerea IVF (Sweden) | |
| 13:40-14:00 | HT lead-free and sinter materials | Mr. M. Ueshima | Senju Metals | |
| 14:00-14:20 | Interconnect Materials and Systems for WBG Semiconductors | Mr. A. Miric | Heraeus (Germany) | |
| 14:20-14:40 | The Aluminum Direct Cooling Device for the Power semiconductor | Mr. K. Minami | Showa Denko | |
| Coffee break | ||||
| Chairman: Prof. S. Nagao | ||||
| Reliability and process | ||||
| 15:10-15:30 | Reliability Investigations on WBG Power Switches for Green Energy Applications | Prof. F. Iannuzzo | Aalborg University (Denmark) | |
| 15:30-15:50 | Reliability Issues for New Generation Power Electronics | Dr. H. Ohashi | NPERC-J | |
| 15:50-16:10 | Power Cycling Test Methods | Prof. J. Lutz | TU Chemnitz (Germany) | |
| 16:10-16:50 | Panel discussion and Q&A
“What will make a breakthrough to establish standard materials/designs for WBG in EU-JP cooperation?” |
Mr. F.J. Ibañez
Prof. K. Suganuma Mr. A. Donat Mr. K. Wilke |
DG CNECT, European Commission
Osaka University Siemens Siemens |
|
| 16:50-17:00 | Closing remark | Prof. K. Suganuma | Osaka University | |
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